Institute I: General Materials Properties
Optimization of highly conductive copper-based metal laminates through microstructural design and laminate architecture
As miniaturization in microelectronics is ongoing, the demand for new superior highly conductive materials arises which are able to withstand higher temperatures and loads at the same or improved conductive properties. As the conductivity of materials and alloys is limited by physical nature, the improvement has to result from new composite materials.
The accumulative roll bonding (ARB) process gives the opportunity to produce heterogeneous layered structures at laboratory as well as at industrial scale. The properties of these so-called laminated metal composites (LMC) can be tailored by changing the LMC architecture and the size of the microstructure. Sophisticated combination of different metallic elements or alloys leads to LMCs with highest possible conductivity while their thermal properties outperform conventional materials. Furthermore, it is possible to manufacture materials with very good thermal and mechanical properties while obtaining sufficient conductivity.
This projects objective is to manufacture highly conductive LMCs via the ARB process based on copper and investigate the microstructure as well as the laminate architecture, electrical conductivity, mechanical and thermal properties. As the project is ongoing, an upscaling of the tailored and optimized ARB process to industrial facilities is planned.